Application Types: Ceramic

Technical ceramics such as alumina (Al2O3) are traditionally quite difficult to machine, due to their brittleness and hardness.  CO2 laser processing reduces mechanical stress, allowing lines, slots, holes and other features to be machined.

The laser’s pulse regime is critical when processing ceramic, so the capability of our SR 15i to deliver long pulses up to 1 millisecond is a distinct advantage in these applications.

  • Ceramic cutting and drilling_white background

    Ceramic cutting & drilling

    Ceramic cutting & drilling Technical ceramics are widely used in the microelectronics industry, and are traditionally difficult to machine. These materials are hard and brittle, and components are generally small. Laser processing allows lines, slots, holes and complex profiles to be machined with no tool contact and reduced mechanical stress. The laser process requires very…

  • Microscope image of laser-scribed alumina ceramic

    Alumina scribing

    Alumina scribing Ceramic components can be separated by drilling a series of closely spaced blind holes along the required cutting line. The ceramic is then broken cleanly along this line. In many cases this “scribe and break” technique is faster and more reliable than full cutting. The hole depth and separation must be precisely controlled in…