Alumina scribing
Ceramic components can be separated by drilling a series of closely spaced blind holes along the required cutting line. The ceramic is then broken cleanly along this line. In many cases this “scribe and break” technique is faster and more reliable than full cutting.
The hole depth and separation must be precisely controlled in order to ensure a clean break. The Luxinar SR 15i is particularly well suited to this application, offering pulse widths up to 1 millisecond for complete control of the scribing depth.
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Recommended products
SR 10i
125W sealed CO2 laser source
SR 15i
175W sealed CO2 laser source
SR 25i
250W sealed CO2 laser source
Applications laboratories
Could a laser be used to improve your manufacturing process? We can help you to find out by testing samples of your material or product in one of our applications labs. Our applications lab facilities are open to both new and existing customers and OEMs. Our laboratories are well equipped to carry out a range of processes including cutting, marking, engraving, drilling, scribing, ablation and more. We offer rapid sample turnaround times, detailed application reports, and complimentary advice from our experienced applications engineers. Whatever your process, we can help you to determine the best laser for your application.
