Ceramic cutting & drilling
Technical ceramics are widely used in the microelectronics industry, and are traditionally difficult to machine. These materials are hard and brittle, and components are generally small. Laser processing allows lines, slots, holes and complex profiles to be machined with no tool contact and reduced mechanical stress.
The laser process requires very careful control of the parameters; the Luxinar SR 15i is designed with ceramic processing in mind, allowing control of the pulse width from 2µs to 1ms. The pulse regime of the laser is critical; long pulses and slow process speeds usually produce superior results.
Alumina (Al2O3) is the most common material, but we can also process other ceramics, including zirconia, aluminium nitride and boron nitride.
125W sealed CO2 laser source
175W sealed CO2 laser source
250W sealed CO2 laser source
Could a laser be used to improve your manufacturing process? We can help you to find out by testing samples of your material or product in one of our applications labs. Our applications lab facilities are open to both new and existing customers and OEMs. Our laboratories are well equipped to carry out a range of processes including cutting, marking, engraving, drilling, scribing, ablation and more. We offer rapid sample turnaround times, detailed application reports, and complimentary advice from our experienced applications engineers. Whatever your process, we can help you to determine the best laser for your application.