Cutting FR4

Laser cutting FR4 composites on circuit boards

Circuit boards can be cut mechanically, but this produces a lot of dust and debris, and risks delamination of the FR4 composite substrates. This in turn may cause premature failure of the devices on the board. Laser cutting is therefore an attractive alternative.

Although most FR4 composites have a tendency to char with CO2 laser processing, degating of circuit boards can be successful with some care. If appropriate cutting parameters are chosen, the results may compare favourably with those produced by mechanical cutting – charring can be minimised, and the individual circuits are separated without mechanical contact or stress.

Substrate cutting

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SR 10i
SR 10i

SR 10i

125W sealed CO2 laser source

SR 15i
SR 15i

SR 15i

175W sealed CO2 laser source

SR 25i
SR 25i

SR 25i

250W sealed CO2 laser source

SCX 35
SR 10i

SCX 35

350W sealed CO2 laser source

OEM 45iX
SR 10i

OEM 45iX

450W sealed CO2 laser source

SR 10i

OEM 65iX

650W sealed CO2 laser source

Applications laboratories

Could a laser be used to improve your manufacturing process? We can help you to find out by testing samples of your material or product in one of our applications labs. Our applications lab facilities are open to both new and existing customers and OEMs. Our laboratories are well equipped to carry out a range of processes including cutting, marking, engraving, drilling, scribing, ablation and more. We offer rapid sample turnaround times, detailed application reports, and complimentary advice from our experienced applications engineers. Whatever your process, we can help you to determine the best laser for your application.