Kiss cutting is the process of selectively cutting the top layer of a material, leaving the underlying layers intact. For example, our CO2 lasers can be used for kiss cutting self-adhesive labels made from paper, plastic, or a combination of both.
While traditional die cutting is well suited for this rapid, high-volume process, laser cutting provides far greater flexibility – cutting outlines can be changed as often as desired with no need for additional tooling, and the process can be applied to a wide range of materials.
The high stability of Luxinar’s lasers is critical in kiss cutting applications, where the laser must consistently cut the sticker and adhesive without damaging the carrier or backing paper. Different material types and thicknesses are accommodated by adjustment of the laser parameters. In addition, our lasers are available in three different wavelengths, allowing the laser to be tailored according to the absorption of the label material in some cases.
Could a laser be used to improve your manufacturing process? We can help you to find out by testing samples of your material or product in one of our applications labs. Our applications lab facilities are open to both new and existing customers and OEMs. Our laboratories are well equipped to carry out a range of processes including cutting, marking, engraving, drilling, scribing, ablation and more. We offer rapid sample turnaround times, detailed application reports, and complimentary advice from our experienced applications engineers. Whatever your process, we can help you to determine the best laser for your application.