In the microelectronics industry, multiple devices are typically fabricated at once on a single substrate. The substrate is then cut to separate the individual components or circuits. Substrates are typically ceramic or FR4 composite, both of which can be laser cut. The non-contact nature of the laser process minimises the risk of damaging the small components, reducing waste and increasing throughput.
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Marking electronic components
Ceramic cutting & drilling
Thin film cutting
Backlight unit (BLU) patterning
Could a laser be used to improve your manufacturing process? We can help you to find out by testing samples of your material or product in one of our applications labs. Our applications lab facilities are open to both new and existing customers and OEMs. Our laboratories are well equipped to carry out a range of processes including cutting, marking, engraving, drilling, scribing, ablation and more. We offer rapid sample turnaround times, detailed application reports, and complimentary advice from our experienced applications engineers. Whatever your process, we can help you to determine the best laser for your application.