Electronics
In the microelectronics industry, multiple devices are typically fabricated at once on a single substrate. The substrate is then cut to separate the individual components or circuits. Substrates are typically ceramic or FR4 composite, both of which can be laser cut. The non-contact nature of the laser process minimises the risk of damaging the small components, reducing waste and increasing throughput.
Other applications for our CO2 lasers include laser marking electronic components, drilling holes in mobile phone cases, cutting plastic films for touch screens, and patterning plastic screens for backlit displays.
