Processing electronics with laser precision

In the microelectronics industry, multiple devices are typically fabricated at once on a single substrate. The substrate is then cut to separate the individual components or circuits. Substrates are typically ceramic or FR4 composite, both of which can be laser cut. The non-contact nature of the laser process minimises the risk of damaging the small components, reducing waste and increasing throughput.

Other applications for our CO2 lasers include laser marking electronic components, drilling holes in mobile phone cases, cutting plastic films for touch screens, and patterning plastic screens for backlit displays.

Microelectronic circuit in gloved hand

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Marking electronic component

Marking electronic components

Laser cutting FR4 composites on circuit boards

Cutting FR4

Ceramic cutting and drilling

Ceramic cutting & drilling

Microscope image of laser-scribed alumina ceramic

Alumina scribing

Cutting plastic films for touch screens

Thin film cutting

Backlight unit (BLU) patterning

Backlight unit (BLU) patterning

Applications laboratories

Could a laser be used to improve your manufacturing process? We can help you to find out by testing samples of your material or product in one of our applications labs. Our applications lab facilities are open to both new and existing customers and OEMs. Our laboratories are well equipped to carry out a range of processes including cutting, marking, engraving, drilling, scribing, ablation and more. We offer rapid sample turnaround times, detailed application reports, and complimentary advice from our experienced applications engineers. Whatever your process, we can help you to determine the best laser for your application.